Posts on this page of our Blog relate to products and information from Holo/Or.
For more information about our suppliers and their products, please contact us.
Diffractive optical elements (DOEs) are the way to get better results in picosecond laser skin treatment according to a recent article, entitled “Diffractive micro-lens array (DLA) for uniform and selective picosecond laser treatment.” The researchers found that compared to a regular micro-lens array, diffractive beam splitters and diffractive lens arrays provide better uniformity and penetration of … Continue reading
What are high power ZnSe beam splitters? High power CO2 lasers are highly useful in multiple applications, including marking and perforation of textiles, paper and plastics; skin treatments; and even glass welding. With increasing laser power, such laser systems can no longer be point-by-point scanned at sufficient speed to fully utilize the laser energy, requiring … Continue reading
In the semiconductor industry, extremely small surface defects and particles are a major concern that reduces yield and also costs producers time and money. It is therefore critical to inspect the surface of semiconductor wafers for defects and contamination, a challenge many of Holo/Or’s customers in the semiconductor metrology industry face. One of the faster … Continue reading
Have you tried our beam samplers for laser process monitoring? These simple, robust grating-like DOEs are coated with high LDT AR coating and can handle high power densities and ultrashort (including fs) pulses. Diffractive samplers have multiple orders that can be used for sampling the beam with various ratios. For example, the first order can sample … Continue reading
A top hat laser beam is a laser beam whose intensity profile is flat and uniform, with sharp edges where the energy drops rapidly to zero. Such a flat-top energy distribution is called a top hat energy distribution. This beam shape is highly useful in many industrial laser applications. The top hat energy distribution can … Continue reading
In many flat panel processes, such as Organic Light-Emitting Diode (OLED) production, thin, flexible layers must undergo processing steps such as lithography, etching, and dicing. Such processes require rigid substrates. Therefore the flexible material is often bonded to a rigid, thick carrier wafer. After processing is completed, a laser is used to de-bond the flexible … Continue reading