DeepCleave Module for Cutting Applications
The module focuses an incident single mode laser into a tight spot with ~1.8 µm waist size along the entire Depth of Focus range (1–2 mm typical range).
|PN||Depth of Focus (DOF)|
The focused spot is equivalent to 0.35 objective NA and is ideally suited for cutting of thick glass, such as flat panels.
The DeepCleave module differs from standard EF elements by enabling constant peak power along the focus region and requiring low M2 and accurate input beam size.
Reasons to choose DeepCleave for your gas cutting application include:
- Full depth glass cut from single pulse
- Complete solution in a single module
- Very low aberrations level- spot diameter < 2 µm
- Easy to integrate into existing opto-mechanics
Each DeepCleave module is shipped from the factory with a full optical characteristics and individual testing report.
Ray tracing simulation of standard Bessel Beam (red) Vs. DeepCleave (blue)
Almost no energy is wasted in DeepCleave
New standard DeepCleave designs are now available. To see the specification table, click here.
For more information about this or other Holo/Or products, contact Holo/Or.