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Continuous wave (CW), diode-pumped solid state (DPSS) green lasers available from IL Photonics at the following wavelengths (nm):
For more information, contact Moshe.
Using highly stable single-line CO2 lasers from Access Laser to measure plasma density and temperature in tokamak fusion experiments is one of many cutting-edge applications for these devices.
The IXDICE Ultra 1342 is a high repetition rate, all-solid-state, diode-pumped, Q-switched laser with the unique fundamental wavelength of 1342 nm. It is the amplified high power version of the IXDICE 1342 laser. With an average output power of 18 W, it is the most powerful system on the market at this special wavelength.
The laser is optimized for high pulse repetition rates in the range 30 to 200 kHz to allow high throughput in material processing applications. Due to its high pulse-to-pulse stability and the sealed housing, this laser is well suited for continuous 24/7 industrial use.
Terry Hancock and Tom Masterson shot this amazing photo of the green comet C/2022 E3 (ZFT) passing by Mars on Feb. 10, from the Grand Mesa Observatory at Purdy Mesa, CO. This image was captured with a color camera using a Chroma Technology luminance filter.
A top hat laser beam has a profile whose intensity is flat and uniform, with sharp edges where the energy drops rapidly to zero. This beam shape is highly useful in many industrial laser applications.
A top hat laser beam shaper uses a transparent window with an accurately defined surface to modulate the phase of an incoming laser beam. The diffractive optical element (DOE) consists of a transparent window with a surface relief structure of varying height. When the laser beam passes through the DOE, the light is delayed as it passes through areas of greater height, thus causing a local modulation of the phase. This phenomenon shapes the beam into a top hat profile at the far field, typically the work plane of a lens in industrial laser systems.
Some applications for the top hat laser beam:
For more information, contact Holo/Or.
In many flat panel processes, such as Organic Light-Emitting Diode (OLED) production, thin, flexible layers must undergo processing steps such as lithography, etching, and dicing. Such processes require rigid substrates. Therefore the flexible material is often bonded to a rigid, thick carrier wafer.
After processing is completed, a laser is used to de-bond the flexible layers in a process known as laser lift off. This process often employs high power UV lasers to weaken the adhesive. In such a process, the laser uniformity is critical. Non-uniform illumination will result in unequal bonding, which may leave contamination, and thus risk damaging the active layer.
Thus, laser lift-off can benefit from top hat beam shaping, typically in the form of a thin line, top-hat laser beam with sharp edges. This beam is scanned over the surface in strips to enable uniform and high throughput de-bonding.
Do you want to shape your laser into a flat top? Contact Holo/Or for help.