High Precision Processing of Flexible or Thick Glass
Processing (cutting or micro-structuring) tempered or non-tempered, flexible or thick glass with high precision can be a challenging task. Mesh glass wafers and wafers for wafer-level-packaging (WLP) require various shapes of through-holes with high aspect ratio channels in the same wafer. Femtosecond lasers are perfect for both selective laser etching (SLE) and 5-axis drilling heads.
Industrial applications for femtosecond lasers include:
- Conical drilling
- Fibers cleaving
- Selective ablation
- Biopsy probes drilling
- Polymer polishing
- Periodic surface structuring
- Color center formation
- Stainless steel polishing
- Stent cutting
- Precision parts cutting
- Glass cutting
- Glass drilling
- Milling of complex 3D structures
- High contrast marking
The CARBIDE laser from Light Conversion is a common choice for SLE and glass drilling applications. The features of the CARBIDE include:
- 190 fs – 20 ps tunable pulse duration
- 2 mJ maximum pulse energy
- 80 W maximum output power
- Single-shot – 2 MHz repetition rate
- Pulse picker for pulse-on-demand mode
- BiBurst
- Air-cooled version
- Automated harmonic generators
- Scientific interface module
To download a datasheet for CARBIDE, click here.
To request more information or a quotation for this or other Light Conversion products, contact IL Photonics.
(Picture: Example of densely packed holes glass drilling. Courtesy of Workshop of Photonics.)