Holo/Or’s Modified Bessel Objectives
In the last few years, Holo/Or has seen increased interest in Through Glass Via (TGV) laser drilling, using ultra short pulse lasers.
Holo/Or offers a variety of beam shaping objectives for integrators interested in developing their TGV process.
Holo/Or’s DeepCleave modified Bessel objectives generate a waist of 1.8 µm over a depth of focus that can be as little as 80 µm or as large as 3000 µm, with constant energy along the waist. This enables ultimate tailoring of the laser energy to the glass modification process requirements, without wasted energy above the modification threshold.
For a more flexible solution suitable for process development, Holo/Or’s variable DOF Bessel objective provided the same waist width of ~2 µm over an adjustable DOF range from 0.1 to 1.5 mm.
Read more about DeepCleave in the first comment, and feel free to contact us for you TGV needs.
About Holo/Or
Holo/Or develops, designs and manufactures diffractive optical elements (DOEs) and micro-optical elements for any wavelength, from DUV to far IR, as well as software/automation solutions for the design. Holo/Or’s products include:
If you are interested in DOEs for your application, contact Holo/Or.