Introducing Holo/Or’s 1X7 MS Multi-Spot Beam Splitter
Many sensitive laser applications in microelectronic and flat panel industries require parallel ablation or scribing of lines on a flat substrate. These sorts of applications often employ Holo/Or’s Multi-Spot Beam Splitter DOEs to create the spots used for the parallel writing, along with a scanner or moving stage. For sensitive applications in the UV and green laser wavelengths, the presence of residual laser energy in undesired diffracted orders can create unacceptable defects (“scratches”) near the processed area. To deal with this issue, Holo/Or has developed improved 1D splitter designs. These new devices have significantly reduced energy in the undesired orders. Especially useful in this regard is their new 1X7 MS with undesired orders less than 5% than the desired. This is a 2x improvement relative to their normal designs.
For more information, contact Holo/Or.