Multi-Spot Beam Splitters for Parallel Ablation or Scribing of Lines
Many applications in the solar panels and microelectronic industries require parallel ablation or scribing of lines on a flat substrate. Two of these applications are scribing of electrodes and copper removal. These sorts of applications can use Multi-Spot Beam Splitters, along with a scanner. Multi-Spot Beam Splitters are a type of Diffractive Optical Element (DOE) produced by Holo/Or. These DOEs can create the spots used for the parallel writing applications. Often, a large area needs to be covered by the spots with good uniformity and at short wavelengths (UV and green, mostly). Achieving this task is often challenging. Over the years, Holo/Or has developed methods for dealing with such systems. These include full design of the focusing systems to be used with their Beam Splitter DOE to achieve the required performance.
For enhanced performance, use Holo/Or’s HEDS / HEQS elements, which are special sub-aperture-based DOEs. These elements are capable of splitting the input beam into parallel spots with >95% efficiency, without almost any power in undesired orders. These DOEs are perfect for customers with highly demanding power applications. However, customers should be aware that unlike the regular multi-spot elements, the HEDS/HEQS are sensitive to centration and alignment.
For more information, contact Holo/Or.