New Beam Splitting Scheme for Line Scribing
Following their work on PV etch patterning in the BURST Project, Holo/Or has developed a novel beam splitting scheme with improved uniformity for line scribing applications!
In the standard method, a line of spots generated by their diffractive optical element (DOE) beam splitter is scanned to generate parallel channels or perforations to process the workpiece along given lines. Spot-to-spot uniformity is typically very good (<5%), but for some cases it can be worse, especially when creating >100 spots or with very close operations.
Holo/Or has found that by designing a beam splitter that splits the spots with the same spot separation as a line but with spots staggered in the other axis (zig-zag for example), spot-to-spot uniformity is significantly improved! When scanned, this pattern can process an area as a line, but with much better uniformity and also with less energy in undesired diffraction orders. This functionality is needed in many laser material processing applications.
About Holo/Or
Holo/Or develops, designs and manufactures diffractive optical elements (DOEs) and micro-optical elements for any wavelength, from DUV to far IR, as well as software/automation solutions for the design. Holo/Or’s products include:
If you are interested in DOEs for your application, contact Holo/Or.