Tag Archives: cutting

DeepCleave Module for Cutting Applications

The DeepCleave module from Holo/Or is a complete optical solution for cutting applications. There is no need for additional high NA objectives or other high cost optics. The module focuses an incident single mode laser into a tight spot with ~1.8 µm waist size along the entire Depth of Focus range (1–2 mm typical range). PN Depth … Continue reading

22-Nov-2020 Blog, Holo/Or, Optics

Glass Cutting with Ultra-Short IR Laser Pulses

Laser glass cutting with ultra-short IR pulses is now a key technique for high throughput glass processing. Cutting thick glass (>500 um) using this technique possesses unique challenges. Specifically, this technique requires focusing the laser energy to a tight spot and spreading the beam evenly throughout the glass depth. To learn more about several solutions … Continue reading

10-Dec-2019 Blog, Holo/Or, Optics

Transforming Multi-Mode Laser Beam into Narrow Ring

Transforming the beam of a highly multi-mode laser into a narrow ring (annular shape) with almost single mode diffraction-limited ring width is a potentially useful technique for certain material processing applications, such as drilling and cutting. Holo/Or has published an experimental demonstration of their unique diffractive method of doing this transformation. For an article on … Continue reading

11-Nov-2019 Blog, Holo/Or, Optics
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