Top Hat Beam Shaping Enables Laser Lift-Off
In many flat panel processes, such as Organic Light-Emitting Diode (OLED) production, thin, flexible layers must undergo processing steps such as lithography, etching, and dicing. Such processes require rigid substrates. Therefore the flexible material is often bonded to a rigid, thick carrier wafer. After processing is completed, a laser is used to de-bond the flexible … Continue reading