Processing (cutting or micro-structuring) tempered or non-tempered, flexible or thick glass with high precision can be a challenging task. Mesh glass wafers and wafers for wafer-level-packaging (WLP) require various shapes of through-holes with high aspect ratio channels in the same wafer. Femtosecond lasers are perfect for both selective laser etching (SLE) and 5-axis drilling heads. … Continue reading
Laser glass cutting with ultra-short IR pulses is now a key technique for high throughput glass processing. Cutting thick glass (>500 um) using this technique possesses unique challenges. Specifically, this technique requires focusing the laser energy to a tight spot and spreading the beam evenly throughout the glass depth. To learn more about several solutions … Continue reading
Laser glass cutting with ultra-short IR pulses is fast becoming a key technique for high throughput glass processing. Cutting of thick glass (> 500 µm) using this technique possesses unique challenges, as the laser energy needs to be both focused to a tight spot and spread evenly throughout the depth of the glass. To help … Continue reading
Time and Place for this workshop: June 24, 13:30-14:30, Hall B3, Booth #303 In the upcoming workshop during the Laser World of Photonics Exhibition in Munich, Mr. Jeffrey Fantl of Holo/Or will talk about beam shaping needs for industrial applications. The talk will focus on three popular laser applications where beam shaping is a major … Continue reading