High Precision Processing of Flexible or Thick Glass
Processing (cutting or micro-structuring) tempered or non-tempered, flexible or thick glass with high precision can be a challenging task. Mesh glass wafers and wafers for wafer-level-packaging (WLP) require various shapes of through-holes with high aspect ratio channels in the same wafer. Femtosecond lasers are perfect for both selective laser etching (SLE) and 5-axis drilling heads. … Continue reading