Tag Archives: Laser Lift-Off

Top Hat Beam Shaping Enables Laser Lift-Off

In many flat panel processes, such as Organic Light-Emitting Diode (OLED) production, thin, flexible layers must undergo processing steps such as lithography, etching, and dicing. Such processes require rigid substrates. Therefore the flexible material is often bonded to a rigid, thick carrier wafer. After processing is completed, a laser is used to de-bond the flexible … Continue reading

25-Jan-2023 Blog, Holo/Or, Optics
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