Tag Archives: laser separation

Multifocal DOEs Enable Laser Separation of Sapphire Wafers

Researchers at Nanyang Technological University of Singapore successfully demonstrated a multi-foci laser cutting technology for sapphire wafer separation, using Holo/Or multi-focal DOEs. Sapphire wafers are used for manufacturing LEDs. Unlike typical cases where the entire cross-section needs to be scanned with single or multiple passes, this team developed a new separation technique, using only partial thickness scanning, … Continue reading

25-Jul-2022 Blog, Holo/Or, Optics
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