TGV process using Holo/Or`s VB Objective
The electronics industry is experiencing a surge in the demand for glass interposers, leading to an increased need for efficient Through Glass Vias (TGV) processing. Utilizing ultra-short laser pulses is a popular method for achieving top-notch TGV quality, whether by directly drilling the glass or preparing it for a subsequent alkaline wet etch process. The laser TGV technique mandates a high energy density, necessitating a precise laser focus of 1–3 µm diameter spread across the entire glass depth (typically 500–1000 µm).
For optimal results in your laser TGV process, consider the Holo/Or Variable Bessel objective as a versatile focusing solution. Offering a depth of focus ranging from 0.08–1.5 mm and maintaining a stable 2 µm waist, the VB module enables easy adjustment of the Depth of Field (DOF) to accommodate various glass interposer thicknesses. This adaptability enhances the versatility of your laser TGV machine, ensuring efficient and precise processing.
Explore more about Holo/Or’s VB module for comprehensive details.
About Holo/Or
Holo/Or develops, designs and manufactures diffractive optical elements (DOEs) and micro-optical elements for any wavelength, from DUV to far IR, as well as software/automation solutions for the design. Holo/Or’s products include:
If you are interested in DOEs for your application, contact Holo/Or.