Top Hat Beam Shaping Enables Laser Lift-Off
In many flat panel processes, such as Organic Light-Emitting Diode (OLED) production, thin, flexible layers must undergo processing steps such as lithography, etching, and dicing. Such processes require rigid substrates. Therefore the flexible material is often bonded to a rigid, thick carrier wafer.
After processing is completed, a laser is used to de-bond the flexible layers in a process known as laser lift off. This process often employs high power UV lasers to weaken the adhesive. In such a process, the laser uniformity is critical. Non-uniform illumination will result in unequal bonding, which may leave contamination, and thus risk damaging the active layer.
Thus, laser lift-off can benefit from top hat beam shaping, typically in the form of a thin line, top-hat laser beam with sharp edges. This beam is scanned over the surface in strips. This enables uniform and high throughput de-bonding.
Do you want to shape your laser into a flat top? Contact Holo/Or for help.
Holo/Or develops, designs and manufactures diffractive optical elements (DOEs) and micro-optical elements for any wavelength, from DUV to far IV, as well as software/automation solutions for the design. If you are interested in DOEs for sapphire separation, glass cutting or other applications, contact Holo/Or.