Variable Multibeam Tool Enables High Accuracy and Throughput
In an article entitled, “Variable multibeam tool enables high accuracy and throughput”, the authors write:
Miniaturization drives the industry. While feature densities increase due to the smaller structure sizes required in electronics and display manufacturing, laser scanning speed must also increase to hit throughput targets in terms of moves per second for drilling and other manufacturing processes.
On the other hand, ultrashort-pulse lasers are gaining ever-more average power and pulse energy, thanks to continual technological developments. The main obstacle to fully use these high powers for industrial processes is typically the scanning technology, as the pulse separation needs to be high enough to avoid heat accumulation effects on the workpiece.
Two promising approaches for increasing the usable power levels that can be applied include polygon scanning and process parallelization.
A joint development project focuses on parallelization by using multiple beams on one main scanner. This so-called ‘multibeam laser scanning’ configuration allows speeding of laser processes in applications where a high number of identical structures need to be processed with high structure densities—for example, for high-density printed circuit board (PCB) or microLED display manufacturing.
This dynamic multibeam scanning system includes a diffractive optical element (DOE) from Holo/Or. This device splits the laser’s main beam into four identical sub-beams. Accordingly, the multibeam scanner emits four sub-beams with a variable vertical spot spacing between 0.4 and 1.6 mm.
To read the full paper, click here.
For more information about this or other Holo/Or products, contact Holo/Or.
(This item was originally posted by Holo/Or on LinkedIn.)